“HBM: Memory Solution for Bandwidth-Hungry Processors”, Joonyoung Kim and Younsu Kim [SK hynix Inc.], August 2014｜リンク
“The Era of High Bandwidth Memory”, Kevin Tran [SK hynix Inc.]｜リンク
“A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory”, Sangyong Lee and others [SK hynix Inc.], 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)｜リンク
“Through Silicon Via (TSV) Packaging for Improved Performance”, Paul Silvestri, Rama Alapati and Mike Kelly [Amkor Technology, Inc.]｜リンク
“Expanding the Boundaries of the AI Revolution: An-In-depth Study of High Bandwith Memory”, Changyong Ahn & Nayoung Lee [SK hynix Inc.], March 2019｜リンク
“HBM Package Integration: Technology Trends, Challenges and Applications”, Suresh Ramalingam [Xilinx, Inc.], Aug 21, 2016｜リンク
“High performance HBM Known Good Stack Testing”, Marc Loranger [Formfactor Inc.], John Oonk[Teradyne Inc.], Semiconductor Wafer Test Workshop, June 5-7 2015｜リンク
“Verification of Singulated HBM2 stacks with a KGS Test Cell”, Dave Armstrong [Advantest Corp.], Toshiyuki Kiyokawa [Advantest Corp.], Quay Nhin [Formfactor Inc.], Semiconductor Wafer Test Workshop, June 4-7 2017｜リンク
“Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3GHz/6Gbps”, Byeongseon Ko [SK hynix Inc.], Alan Liao [Formfactor Inc.], Semiconductor Wafer Test 2021 Conference, 2021｜リンク
SK hynix, 2023 Tech Seminar, Jul 12, 2023 Competitive Edge of SKH’s HBM｜リンク
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